Epoxy resins based on diaminobisimide compounds

Details Epoxy resins based on diaminobisimide compounds Epoxy resins based on diaminobisimide compounds

1996-01-11

1997-12-02

Dees, Jose G.

Organic compounds -- part of the class 532-570 series

Organic compounds

Heterocyclic carbon compounds containing a hetero ring...

548433, C07D48722, C07D48714

Patent

active

056938225

ABSTRACT:
A method for the preparation of diaminobisimide compounds of the formula (I) which are substantially free of oligomers and are useful as curing agents in epoxy resin formulations: ##STR1## wherein Ar.sup.1 is an optionally substituted aromatic residue which provides for good conjugation between the nitrogen containing groups; and Ar is an optionally substituted aromatic residue, comprising heating an aromatic diamine of the formula H.sub.2 N--Ar.sup.1 --NH.sub.2, with an aromatic tetracarboxylic acid of the formula (HOOC).sub.2 (COOH).sub.2 or the corresponding dianhydride.

REFERENCES:
patent: 4251418 (1981-02-01), Chow et al.
patent: 4340715 (1982-07-01), Gounder et al.
patent: 5185451 (1993-02-01), Stutts et al.
Hodgin, J. Poly. Sci. (Poly. Chem.), 14, 409-31 (1976).
Dorogova et al., Chemical Abstracts 97(13), abst. 109892 (1982).

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