Epoxy resinous molding compositions having low coefficient of th

Details Epoxy resinous molding compositions having low coefficient of th Epoxy resinous molding compositions having low coefficient of th

1981-09-10

1982-11-09

Jacobs, Lewis T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

428413, C08L 6300

Patent

active

043585523

ABSTRACT:
An improved epoxy molding composition for encapsulating microelectronic devices wherein the molding composition, after conversion to a thermoset condition, i.e., infusible state, by the application of heat and pressure, displays a low coefficient of thermal expansion and a high thermal conductivity. The dual properties of low coefficient of thermal expansion and high thermal conductivity are imparted to the molding composition by the incorporation therein of a specific anisotropic, polycrystalline, sintered ceramic product which is relatively non-abrasive and free of ionic contaminants and which has cordierite as its primary phase, consisting essentially on an analytical oxide basis of 11.5 to 16.5% RO, 33 to 41% Al.sub.2 O.sub.3 and 46.6 to 53% SiO.sub.2.

REFERENCES:
patent: 4038491 (1977-07-01), Gamble et al.
patent: 4043969 (1977-08-01), Sporck

Affiliated with

Also associated with

Rating

Epoxy resinous molding compositions having low coefficient of th does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Epoxy resinous molding compositions having low coefficient of th, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epoxy resinous molding compositions having low coefficient of th will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-746398