Epoxy resin system and pultrusion process employing same

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

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Details

156180, 156245, 156330, 264137, 264258, 264263, B29C 3502, B29K 6300, B32B 3112

Patent

active

048426679

ABSTRACT:
An epoxy resin system is disclosed which is especially adapted for use in the pultrusion process. Such resin system comprises tris (hydroxyphenyl) methane-based epoxy resin and a combination of the cross-linking agents (methyl)-bicyclo(2,2,1) heptane-2,3-dicarboxylic anhydride and poly sebacic poly anhydride, the ratio of the dicarboxylic anhydride to the total amount of cross-linking agents ranging from 0.65 to 0.80 and the ratio of the poly anhydride to the total amount of cross-linking agents ranging from 0.35 to 0.20. The amount of total cross-linking agents to epoxy resin ranges from about 60 to about 80 parts total cross-linking agents, per 100 parts resin, by weight. A small amount of an imidazole accelerator, preferably 2-ethyl-4 methyl imidazole, is included. The pultrusion process includes the steps of creeling a plurality of fabric bands or individual fiber tows, collating the creeled bands, passing the array of collated bands through the above epoxy resin system heated in a wet-out tank, passing the wetted array of fabric bands through a forming guide to form a resin impregnated laminate, passing the laminate through a heated pultrusion die, and discharging a continuous length of cured fiber-epoxy composite from the die.

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