Epoxy resin photoresist with iodoform and bismuth triphenyl

Details Epoxy resin photoresist with iodoform and bismuth triphenyl Epoxy resin photoresist with iodoform and bismuth triphenyl

1975-02-26

1976-08-31

Brammer, Jack P.

Gas separation: apparatus

Electric field separation apparatus

Electrode cleaner, apparatus part flusher, discharger, or...

96 36, 96115P, 20415918, 20415923, 20415924, 427 43, G03C 500, G03C 168, C08F 246, C01Y 119

Patent

active

039778746

ABSTRACT:
Photopolymerizable compositions and processes for photopolymerizing such compositions are provided, said process comprising admixing with said epoxides, photosensitive organohalogen compounds in combination with an organometallic compound and thereafter applying energy to the resulting mixture. The organohalogens decompose to liberate an active catalyst which then serves to initiate polymerization of the epoxide material. The organometallic compound functions synergistically with the organohalogen to enhance the film forming properties of the resulting polymer and or sensitivity of the polymerizable system.

REFERENCES:
patent: 3427259 (1969-02-01), Garty et al.
patent: 3522194 (1970-07-01), Hada et al.
patent: 3708296 (1973-01-01), Schlesinger
patent: 3711391 (1973-01-01), Feinberg
patent: 3720634 (1973-03-01), Statton
patent: 3721617 (1973-03-01), Watt

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