Epoxy resin/phenolic OH-aramid/ban block copolymer product with

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428408, 428418, 428209, 523436, C08L 6302, C08L 6304

Patent

active

053346629

ABSTRACT:
An epoxy resin modified material is disclosed, which is obtained by reacting an epoxy resin and a phenolic hydroxyl group-containing aramid/polybutadiene-acrylonitrile block copolymer represented by formula (I): ##STR1## wherein Ar.sup.1 and Ar.sup.3 each represent a divalent aromatic group; Ar.sup.2 represents a phenolic hydroxyl group-containing divalent aromatic group; x represents an integer of from 3 to 7; y represents an integer of from 1 to 4; y/(x+y) is from 0.1 to 0.3; z represents an integer of from 5 to 15; m represents an integer of from 1 to 400; n represents an integer of from 1 to n/(m+n) is from 0.01 to 0.50; and l represents an integer of from 1 to 50. An epoxy resin composition containing the epoxy resin modified material and a carboxyl-terminated polybutadiene-acrylonitrile copolymer is useful as a cationic electrodeposition coating.

REFERENCES:
patent: 5189101 (1993-02-01), Burlett et al.
Derwent Abstract No. 83-18783K/08 of Japanese Patent No. 58-7426 to Japan Synthetic Rubber, published Jan. 17, 1983.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Epoxy resin/phenolic OH-aramid/ban block copolymer product with does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Epoxy resin/phenolic OH-aramid/ban block copolymer product with , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epoxy resin/phenolic OH-aramid/ban block copolymer product with will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-65291

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.