Epoxy resin moulding compositions

Chemistry of carbon compounds – Miscellaneous organic carbon compounds

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Details

260 38, 525109, 525481, 525486, 525489, 525523, 525934, 528 98, 528104, C08G 5928, C08G 5962

Patent

active

042461626

ABSTRACT:
A moulding composition consisting of an epoxy resin adduct of a low molecular diglycidyl ether of bisphenols and an aromatic diamine together with a filler, an accelerator, and an aromatic polyol as hardener. Mouldings having excellent resistance to cracking can be obtained from this moulding composition.

REFERENCES:
patent: 3028251 (1962-04-01), Nagel
patent: 3496130 (1970-02-01), Wasem et al.
patent: 3538184 (1970-03-01), Meer
patent: 3694407 (1972-09-01), Krikorian
patent: 4129556 (1978-12-01), Zondler et al.

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