Stock material or miscellaneous articles – Composite – Of epoxy ether
Reexamination Certificate
2007-09-25
2011-12-27
Feely, Michael J (Department: 1761)
Stock material or miscellaneous articles
Composite
Of epoxy ether
C257S788000, C257S791000, C257S793000, C428S447000, C525S476000, C525S524000, C525S525000
Reexamination Certificate
active
08084130
ABSTRACT:
The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. The epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerating agent, (D) an inorganic filler, and (E) an alkoxysilane polymer, wherein the alkoxysilane polymer (E) is a polymer obtained by polymerizing an alkoxysilyl group moiety of a specific alkoxysilane compound.
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Hamada Mitsuyoshi
Ikeba Hiroaki
Nagai Akira
Nanaumi Ken
Yasuzawa Kouhei
Antonelli, Terry Stout & Kraus, LLP.
Feely Michael J
Hitachi Chemical Co. Ltd.
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