Epoxy resin molding material for sealing and electronic...

Stock material or miscellaneous articles – Composite – Of epoxy ether

Reexamination Certificate

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Details

C257S788000, C257S791000, C257S793000, C428S447000, C525S476000, C525S524000, C525S525000

Reexamination Certificate

active

08084130

ABSTRACT:
The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. The epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerating agent, (D) an inorganic filler, and (E) an alkoxysilane polymer, wherein the alkoxysilane polymer (E) is a polymer obtained by polymerizing an alkoxysilyl group moiety of a specific alkoxysilane compound.

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patent: 6821657 (2004-11-01), Takahashi et al.
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patent: 2005-281619 (2005-10-01), None
Machine translation of JP 2005-015561 A, provided by the JPO website (no date).
Machine translation of JP 2005-015565 A, provided by the JPO website (no date).
Machine translation of JP 2005-036085 A, provided by the JPO website (no date).
STN Registry Record of X-22-161A (no date).
“Mounting Technology of Surface-Mounted LSI Package and Improvements in Its Reliability” edited by the Semiconductor and Integrated Circuit Division, Hitachi Ltd., Applied Technique Publishing Corporation (Ohyo Gizyutsu Shuppan according to transliteration), pp. 254-256, Nov. 16, 1988.
“High Reliability for Semiconductor Sealing Resin” edited by Technical Information Institute Co., Ltd., Technical Information Institute Co., Ltd., pp. 172-176, Jan. 31, 1990.
Chinese Official Action dated Nov. 9, 2010, for CN Application No. 200780036852.4.
Korean Official Action dated Feb. 21, 2011, for KR Application No. 10-2009-7008974.
Taiwanese Official Action dated Jul. 5, 2011, for TW Application No. 096136744.

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