Epoxy resin molding compounds

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

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Details

523466, 528118, 528367, C08K 704, C08K 336

Patent

active

048124907

ABSTRACT:
Molding compounds for encapsulating semiconductor components comprise filler-containing polyepoxy resins and a 1,3,5-tris(3-amino-4-alkylphenyl)-2,4,6-trioxohexahydrotriazine with a C.sub.1 to C.sub.4 alkyl radical as a hardener. The molding compounds are storage-stable and moldings manufactured therefrom meet the requirements for these materials.

REFERENCES:
patent: 2838511 (1958-06-01), Kogon
patent: 4525534 (1985-06-01), Rasshofer
Lee et al., Handbook of Epoxy Resins; McGraw-Hill Book Co.; 1967; pp. 14-2,5,17,49,50.

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