Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From phenol – phenol ether – or inorganic phenolate
Reexamination Certificate
1999-06-02
2002-02-26
Lovering, Richard D. (Department: 1712)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
From phenol, phenol ether, or inorganic phenolate
C428S930000, C523S137000, C523S420000, C524S912000, C525S529000, C525S912000, C528S123000
Reexamination Certificate
active
06350843
ABSTRACT:
BACKGROUND OF THE INVENTION
FIELD OF THE INVENTION
The present invention relates to an epoxy resin low electronic impedance high molecular weight polymer.
In the existing high molecular weight polymer series, there is yet no high molecular weight polymer which can be co-polymerized and cross linked with a resin monomer and hardened to form an electrically conductive polymer. Especially, when applied to epoxy resin floor coatings, the epoxy resin itself is an insulating material having excellent insulation, voltage-resistance, electric induction, etc. Generally, the volume resistance coefficient thereof is between 10
12
-10
17
(&OHgr;·cm). In order-to achieve a staticproof or even anti-explosion property, the volume resistance coefficient of the epoxy resin must be lowered to <10
8
(&OHgr;·cm). With respect to the existing technique level, generally, conductive metal particles, carbon black powder, interface activating agent ion crystallized particles, electroplating metal short fibers, etc. are added to the epoxy resin main agent to serve as another kind of filling agent of the epoxy resin. Such filling agent itself fails to participate in the cross linking reaction between the epoxy resin high molecular weight polymers. The current is conducted by means of the contact between the molecular particles of the conductive filling agent. The conductive filling agent does not react with the epoxy resin to crosslink the epoxy resin so that the formed epoxy resin conductive floor layer has numerous defects. For example, the basic physical properties of the epoxy resin are ruined, mechanical strength is deteriorated, working technique is limited, etc. Most seriously, the resin itself not only is not conductive, but also will block the continuity of the current of the conductive filling agent. Therefore, the conductivity is unstable and the conductive floor will gradually lose its conductivity after being worn.
In this high technology time, the electronic and chemical industries have become more and more developed and advanced. Various automatic production equipment is used at high efficiency and speed. This leads to the problem of static. Especially, in the field of the semiconductor industry, the static will result in damage to the electronic circuit of the semiconductor and attachment of great amount of micro-dusts. As a result, a dustless room will be seriously contaminated. In the case that an excessively great amount of static is stored, a static discharging spark may take place. When encountering a combustible or explosive gas, a tragedy of gas explosion may take place. Therefore, the conductive epoxy resin floor plays an important role in the field of industrial factory floor.
With the above background, according to the present invention, the high molecular weight polymer as a non-filling agent directly participates in the cross linking reaction between the epoxy resin polymeric molecules and is copolymerized therewith and hardened to form a two-liquid type cross linking reaction thermosetting engineering plastic. Such plastic has excellent conductivity and is able to fully keep the common physical, chemical and mechanical properties, acid/alkali-resistance, weather-resistance, polish, and long using life of the original epoxy resin. In other words, the plastic is a high molecular epoxy resin polymer with low electronic impedance. More importantly, when applied to pavement to provide a conductive floor coating, not like the conductive filling agent product series which is greatly limited in working technique and method, the high molecular weight epoxy resin polymer c a n be applied according to the conventional working method of the epoxy, resin to achieve the desired objects. Doubtless, the epoxy resin conductive floor coating series of the present invention can be used instead of the existing epoxy resin conductive floor coating series made of conductive filling material. Thus, the serial products of the present invention can be entirely commercialized, popularized and specified.
As mentioned above, the up-to-date technical level of conductive and anti-static high molecular weight polymers is limited to adding a conductive filling agent and there is yet no conductive or anti-static high molecular weight polymer directly participating in the reaction. With respect to the currently collected references, for example, Taiwanese Patent No. 105227 entitled “conductive resin compound”, a resin compound is disclosed, which contains (1) 25-99.5 weight % of isomerized polymer and (2) 0.5-75 weight % of conductive mineral black. It is mentioned in this reference that the resin can be co-used with other “conductive filling materials”. The so-called “conductive filling materials” means metal micro-particle series such as graphite powder, silver powder, copper powder, nickel powder, stainless steel powder, tin dioxide powder, copper/silver mixture powder, nickel/silver mixture powder, silver-painted glass ball, copper gas ball, etc., metal fragment series such as aluminum fragment, bronze fragment, nickel/iron alloy fragment, etc., and metal short fibers including carbon fiber, aluminum fiber, bronze fiber, aluminum strip, cold-plated fiber glass, carbon-painted fiber glass, etc. It can be known from the above description that “conductive filling materials” in fact do not go through a polymerization reaction with the high molecular polymer. Furthermore, it is clearly shown from the comparison table disclosed in the reference that when A/B/C/D four kinds of resins are free from any conductive filling material, the measured volume resistance coefficients are all above 10
16
&OHgr;·cm. Therefore, it can be proved that the resin itself is a high molecular weight polymer which is totally not conductive.
In addition, in Japanese Patent Publication. No.
2-2904 entitled “conductive floor”, a conductive floor painting material is disclosed, which is composed of colored compound resins which are hardened at normal temperature. The compound resins such as epoxy resin, unsaturated polyester resin, etc. are mixed with conductive filling materials such as zinc white powder, aluminum micro-particle, etc. The mixture is co-used with fiber-like reinforcing materials such as carbon fiber, stainless steel fiber, fiber glass, etc. and anti-abrasion metal bone material (stainless steel micro-particles). No conductive polymerization or reaction related to the resin is seen from the description of the reference. This reference merely describes what kind of conductive filling material is added and how the filling material is added to achieve better conductive function. Therefore, it is still concluded that the high molecular weight resin itself is not conductive and substantially insulating.
The interesting thing is that the description mentions that the conductive floor material has a viscosity within a range from 4000 to 13000 cps and thus has a good fluidity. Therefore, a so-called “plane flowing floor surface working method” can be achieved as a break through of the working method. However, this can only achieve a plane surface and versatile colors for selection. The problems of “mirror face polish” and “film thickness” of working are not mentioned. This further proves the fact that the high molecular resin basically is not conductive.
Furthermore, in Taiwanese Patent Publication No. 343987 entitled “anti-static resin”, an anti-static resin compound is disclosed, which is composed of 5-50% hydrophilic copolymer and 50-95% thermoplastic resin. In fact, the hydrophilic copolymer is polymerized by means of self-emulsification polymerization method and pertains to one kind of anti-static interface activating agent. Such anti-static agent is better than a general one. However, basically, it is also a kind of conductive filling material. When blended with ABS resin, it is clearly shown from the table that the lowest resistance coefficient among all the embodiments is only 7×10
9
. The others are all above 10
10
. The electronic impedance of the surface of the formed product is still considerably high.
Browdy and Neimark
Lovering Richard D.
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