Epoxy resin, epoxy resin composition and hardened product thereo

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From phenol – phenol ether – or inorganic phenolate

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Details

528421, C08G 5908

Patent

active

061244201

DESCRIPTION:

BRIEF SUMMARY
FIELD OF THE INVENTION

This invention relates to an epoxy resin, an epoxy resin composition and a hardened product thereof, which are useful in electric and electronic parts-insulating materials, including semiconductor sealing materials with high reliability, and various composite materials, including laminated sheets (printed circuit boards) and CFRP (carbon fiber reinforced plastics), as well as adhesives, paints and the like.


PRIOR ART

Epoxy resin is broadly used in the field of electric and electronic parts, structural materials, adhesives, paints and the like because of its high workability and excellent properties of its hardened products such as electric characteristics, heat resistance, adhesive property, moisture resistance (water resistance) and the like.
However, further improvement of the epoxy resin, in terms of its high purity, heat resistance, moisture resistance, adhesive property, low viscosity for high filler charging and the like various characteristics, has been called for in the electric and electronic field with the recent development. In addition, development of a light weight epoxy resin which has excellent mechanical properties and also has low viscosity for the improvement of workability has been called for as a structural material in the area of aerospace and aircraft materials, leisure and sports tools and the like. In response to these demands, a large number of epoxy resin compositions have been proposed, but they are not satisfactory yet.


DISCLOSURE OF THE INVENTION

With the aim of finding an epoxy resin having the aforementioned characteristics, the inventors of the present invention have conducted intensive studies and accomplished the present invention as the results.
Accordingly, the present invention relates to ##STR1## (in the formula (I), each P represents a hydrogen atom or a methyl group and P in the molecule are mutually the same, R represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and n is a positive number of 0.1 to 20 on average), wherein the plot of melt viscosity of said epoxy resin measured at 150.degree. C. by a cone plate method (variable, y; unit, poise) vs. the ratio of the total weight of 3 to 6 nucleus bodies in said epoxy resin (variable, x; unit, % by weight) satisfies the following conditions: surrounded by the lines of: by the lines of: epoxy resin is an epoxy resin represented by the following formula (II): ##STR2## (in the formula (II), R is as defined in the formula (I)), (3) the epoxy resin according to the aforementioned item (1) wherein P is hydrogen atom and the plot of y vs. x is present within the area surrounded by the lines of 1) y=70e.sup.-0.115x, 2) y=1000e.sup.-0.115x, 3) x=10 and 4) x=70, P is hydrogen atom and an epoxy resin component contained in a fraction which constitutes the top peak (the highest peak) obtained by GPC (gel permeation chromatography) is a 3 nucleus body or a body with more than 3 nuclei, (3) and (4) wherein P is hydrogen atom and its melt viscosity is 0.1 to 400 poises, P is methyl group and the concentration of hydrolyzable halogen is 600 ppm or less, wherein P is methyl group and the plot of y vs. x is present within the area surrounded by the lines of 1) y=500e.sup.-0.120x, 2) y=5000e.sup.-0.120x, 3) y=100 and 4) y=0.2, (2), (6) and (7) wherein P is methyl group, and the ratio of c/d is 2.0 or less, the c (% by weight) being the rate of an epoxy resin component contained in a fraction which constitutes the top peak (the highest peak) obtained by GPC to the total epoxy resin and the d (% by weight) being the rate of an epoxy resin component contained in a fraction which constitutes the second peak (the second highest peak) to the total epoxy resin, of the aforementioned items (1) to (8), wherein it is prepared for use in semiconductor sealing, and composition of the aforementioned item (9) or (10).


BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a graph showing a relationship between the melt viscosity of the epoxy resin of the present invention and the ratio of 3 to 6 nucleus bodie

REFERENCES:
patent: 4518762 (1985-05-01), Krueger et al.
patent: 5106923 (1992-04-01), Bertram et al.

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