Epoxy resin electrical encapsulation composition

Details Epoxy resin electrical encapsulation composition Epoxy resin electrical encapsulation composition

1991-02-15

1992-02-18

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

525481, 525482, 528 89, 528108, C08G 5914

Patent

active

050895435

ABSTRACT:
An electrical encapsulation composition containing an epoxy resin, a phenolic curing agent and a tris(dialkoxyphenyl)phosphine high cured glass transition temperature and good crack resistance.

REFERENCES:
patent: 4105634 (1978-08-01), Hanson et al.

Affiliated with

Also associated with

Rating

Epoxy resin electrical encapsulation composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Epoxy resin electrical encapsulation composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epoxy resin electrical encapsulation composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1824042