Epoxy resin curing agents and epoxy resin compositions

Compositions – Compositions containing a single chemical reactant or plural... – Organic reactant

Reexamination Certificate

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Details

C525S423000, C525S486000, C525S526000, C528S091000, C528S113000, C528S117000, C528S120000, C564S434000

Reexamination Certificate

active

07008555

ABSTRACT:
A curing agent for epoxy agent having N-phenyl-p-phenylenediamine(4-aminodiphenylamine). An epoxy resin combination having a main agent and a curing agent. The main agent has an epoxy resin. The curing agent has a N-phenyl-p-phenylenediamine(4-aminodiphenylamine).

REFERENCES:
patent: 4427802 (1984-01-01), Moulton et al.
patent: 4599413 (1986-07-01), Moulton et al.
patent: 4902215 (1990-02-01), Seemann, III
patent: 5052906 (1991-10-01), Seemann
patent: 6090985 (2000-07-01), MacDiarmid et al.
patent: 6239251 (2001-05-01), Wei et al.
patent: 6410127 (2002-06-01), Kamae et al.
CAPLUS accession No. 1990:44187 for Genies et al., “Electropolymerization reaction mechanism of para-aminodiphenylamine,” Journal of Electroanalytical Chemistry and Interfacial Electrochemistry (1989), vol. 269, No. 1, abstract only.
CAPLUS accession No. 2000:594189 for Wang et al., “Stabilization and anti-corrosion property of phenyl-capped and aniline tetramer as additives to common coating,” Polymer Preprints (2000), vol. 41, No. 2, abstract only.
Derwent accession No. 2000-413230 for Chinese Patent No. 1,250792, Gao et al., Apr. 19, 2000, abstract only.
Chemical abstracts registry No. 80471-61-0 for N-phenyl-p-phenylenediamine(4-aminodiphenylamine), 1990.

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