Epoxy resin curing agent based on blends containing disecondary

Details Epoxy resin curing agent based on blends containing disecondary Epoxy resin curing agent based on blends containing disecondary

1991-01-18

1992-02-25

Kight, III, John

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525481, 525486, 525504, 528 27, 528 99, 528104, 528108, 528109, 528113, 528120, 528123, 528124, 528220, 528228, 528229, 528332, 528341, 528407, 25218213, C08G 5956, C08G 5950

Patent

active

050914740

ABSTRACT:
A two component-type curing agent composition is disclosed which comprises a first curing agent which is capable of cross-linking an epoxy resin and which is at least one member selected from primary amines, phenolic compounds and acid anhydrides, and a second curing agent which is at least one compounds represented by the following general formula: ##STR1## wherein X is --CR.sub.1 R.sub.2 --, --CO--, --COO--, --SO.sub.2 --, --SO--, --S--, --O--, --NR.sub.1 --, --SiR.sub.1 R.sub.2 -- or --POR.sub.1 -- where R.sub.1 and R.sub.2 each stands for hydrogen, a lower alkyl or a phenyl; Y and Y' each stands for hydrogen, a lower alkyl or an electron attracting group; R is a lower alkyl; and m and n each is an integer of 1-4.

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