Epoxy resin curable composition for prepreg

Details Epoxy resin curable composition for prepreg Epoxy resin curable composition for prepreg

2011-03-15

2011-03-15

Feely, Michael J (Department: 1761)

Stock material or miscellaneous articles

Composite

Of epoxy ether

C428S297400, C428S413000, C428S414000, C428S474400, C428S901000, C525S533000

Reexamination Certificate

active

07906213

ABSTRACT:
An epoxy resin curable composition for a prepreg, comprising the following components (A) to (E): (A) a polyamide compound having a structure derived from an aromatic diamine including a phenolic hydroxyl group, the aromatic diamine having the phenolic hydroxyl group in a position adjacent to an amino group; (B) an epoxy resin; (C) an epoxy resin curing agent; (D) a filler; and (E) a solvent.

REFERENCES:
patent: 2915484 (1959-12-01), Kohler et al.
patent: 2010/0112323 (2010-05-01), Mori et al.
patent: 1 099 733 (1961-02-01), None
patent: 2001-31784 (2001-02-01), None
patent: 2001-49082 (2001-02-01), None
patent: 2001-146546 (2001-05-01), None
patent: 2002-256137 (2002-09-01), None
patent: 2005-29720 (2005-02-01), None
patent: WO 2006/129480 (2006-12-01), None
Abstract of WO 2006/129480 A1 (no date).
Machine translation of KR 10-2008-0025089, provided by the KIPO website (no date).
Machine translation of JP 2001-146546, provided by the JPO website (no date).
Machine translation of JP 2002-256137, provided by the JPO website (no date).

Affiliated with

Also associated with

Rating

Epoxy resin curable composition for prepreg does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Epoxy resin curable composition for prepreg, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epoxy resin curable composition for prepreg will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2762749