Epoxy resin compositions with improved heat resistance

Details Epoxy resin compositions with improved heat resistance Epoxy resin compositions with improved heat resistance

1992-07-10

1994-09-20

Dean, Ralph H.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525502, 523429, 523433, 523435, C08G 5902

Patent

active

053490290

ABSTRACT:
Epoxy resin compositions for sealing semiconductor elements are disclosed and include an epoxy resin, a maleimide-modified siloxane compound represented by the formula (1) and an allylphenol-novolac resin represented by the formula (2) as a curing agent, and demonstrate low stress, high heat resistance and moldability. ##STR1## wherein, R.sub.1 denotes a methylene group a phenylene group or a substituted phenylene group,

REFERENCES:
patent: 4288359 (1981-09-01), Graham
patent: 4632966 (1986-12-01), Kanagawa et al.
patent: 4871832 (1989-10-01), Saito et al.
patent: 4985529 (1991-01-01), Saito et al.
patent: 5041474 (1991-08-01), Kim et al.
"Biaspartimide-diamines as Curing Agents for Epoxy Resins" by Devendra Kumar and Alka D. Gupta, from J. Macromol. Sci.-Chem., A22 (8), pp. 1101-1107, copyright 1985.
"DSC Evaluation of Epoxy and Polyimide-Impregnated Laminates (Prepregs)" by L. T. Pappalardo, from Journal of Applied Polymer Science, vol. 21, pp. 809-820, copyright 1977.

Affiliated with

Also associated with

Rating

Epoxy resin compositions with improved heat resistance does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Epoxy resin compositions with improved heat resistance, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epoxy resin compositions with improved heat resistance will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2429958