Epoxy resin compositions, solid state devices encapsulated...

Details Epoxy resin compositions, solid state devices encapsulated... Epoxy resin compositions, solid state devices encapsulated...

2006-12-05

2006-12-05

Sellers, Robert (Department: 1712)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C257S791000, C362S800000, C523S451000, C523S456000, C525S474000, C525S476000, C525S533000

Reexamination Certificate

active

07144763

ABSTRACT:
Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal stabilizers, UV stabilizers, cure modifiers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

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James V. Crivello, “The Synthesis and cationic Polymerization of Novel Epoxide Monomers”,Polymer Engineering and Science, vol. 32, No. 20, pp. 1462-1465 (1992).

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