Epoxy resin compositions for use in low temperature curing appli

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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428273, 428290, 523428, 523434, 525 65, 525113, 525122, C08G 6300

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active

047987618

ABSTRACT:
Compositions comprising a mixture of (A) an epoxy resin composition consisting essentially of (1) at least one epoxy resin which has an average of not more than 2 vicinal epoxy groups per molecule; (2) at least one epoxy resin which has an average of more than 2 vicinal epoxy groups per molecule and (3) at least one rubber or elastomer; and (B) optionally, a low viscosity reactive diluent, are useful in preparing low temperature curable compositions. Also claimed is low temperature curable compositions containing the above components (A) and (B); (C) at least one cycloaliphatic amine hardener and (D) optionally, an accelerator for component (D).

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P. M. Puckett, W. D. White, P. L. Wykowski and E. S. Caplan; "Development of Low Temperature Curing Resins and Adhesives for Composite Repair, Part I", 19th International SAMPE Technical Conference, Oct. 13-15, 1987, pp. 132-144.
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"Formulating with Dow Epoxy Resins Adhesives" brochure from The Dow Chemical Company, published 1984.

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