Epoxy resin compositions for sealing semiconductors

Details Epoxy resin compositions for sealing semiconductors Epoxy resin compositions for sealing semiconductors

1980-03-06

1981-06-02

Jacobs, Lewis T.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

C08K 6300

Patent

active

042710618

ABSTRACT:
In an epoxy resin composition for sealing a semiconductor element containing about 50 to 85% by weight of an inorganic filler, the improvement wherein the inorganic filler comprises at least a silica powder and a calcium silicate powder, and the amount of said calcium silicate powder is about 20 to 75% by weight and the amount of the silica powder is about 25 to 80% by weight based on the total weight of the silica powder and calcium silicate powder.

REFERENCES:
patent: 3397169 (1968-08-01), Wilkinson
patent: 3547871 (1970-12-01), Hofmann
patent: 3567677 (1971-03-01), Webb
patent: 3658750 (1972-04-01), Tsukui et al.

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