Epoxy resin compositions

Details Epoxy resin compositions Epoxy resin compositions

1976-05-11

1977-05-31

Anderson, Harold D.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

260831, C08L 6110, C08L 6302

Patent

active

040268721

ABSTRACT:
In an epoxy resin composition comprising an alicyclic epoxy resin, a curing agent having phenolic hydroxyl group in its molecule and an imidazole curing accelerator, excellent thermal resistance and excellent mechanical properties can be given to the cured epoxy resin composition by blending 100 parts by weight of 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy)cyclohexane-m-dioxane as the alicyclic epoxy resin, 25 to 50 parts by weight of a phenol-formaldehyde condensate as the curing agent having phenolic hydroxyl group in its molecule and 0.1 to 15 parts by weight of at least one imidazole compound selected from the group consisting of 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenyl-4-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-methyl-4-ethylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-azine-2-methylimidazole, 1-azine-2-undecylimidazole and 1-azine-2-ethyl-4-methylimidazole as the imidazole curing accelerator.

REFERENCES:
patent: 3493630 (1970-02-01), Salensky
patent: 3563850 (1971-02-01), Stackhouse et al.
patent: 3838094 (1974-09-01), Sporck
patent: 3862260 (1975-01-01), Sellers et al.

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