Epoxy resin composition with hydrogenated diene glycidyl ether

Details Epoxy resin composition with hydrogenated diene glycidyl ether Epoxy resin composition with hydrogenated diene glycidyl ether

1990-03-12

1992-11-10

Sellers, Robert E.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525489, 525524, 523427, C08L 6302, C08L 6304

Patent

active

051624370

ABSTRACT:
A resin composition, comprisng a glycidyl ether of a hydrogenated conjugated diene polymer, an epoxy resin, and a reaction product of a phenolic compound with formaldehyde, having improved flexibility and thermal stability and useful for sealing a semiconductor device, whereby thermal stress can be effectively reduced.

REFERENCES:
Abstract of Japanese Patent No. 62-241971 published Oct. 22, 1987.
Chemical Abstracts, vol. 98, 1983, listing abstract of Japanese Patent Publication No. 57-180,626 dated Nov. 1982.

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