Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2005-03-22
2005-03-22
Moore, Margaret G. (Department: 1712)
Etching a substrate: processes
Forming or treating thermal ink jet article
C427S272000, C427S468000, C427S487000, C427S489000, C427S490000, C427S496000, C427S503000, C526S204000, C526S217000, C526S242000, C526S245000, C526S266000, C526S268000, C526S273000, C526S279000, C526S324000, C526S325000, C526S346000
Reexamination Certificate
active
06869541
ABSTRACT:
An epoxy resin composition suitable for forming a film of excellent water repellency which comprises an epoxy resin having one or more water repellent groups and two or more cyclic aliphatic epoxy groups per molecule, a triazine-base catalyst for cationic polymerization and a non-polar solvent.
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Handbook of Epoxy Resins, Lee and Neville, 1967,pp. 10-14 through 10-16.
Imamura Isao
Noguchi Hiromichi
Shimomura Akihiko
Canon Kabushiki Kaisha
Fitzpatrick ,Cella, Harper & Scinto
Moore Margaret G.
Zimmer Marc S
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