Epoxy resin composition, resin-encapsulated semiconductor device

Details Epoxy resin composition, resin-encapsulated semiconductor device Epoxy resin composition, resin-encapsulated semiconductor device

1998-02-19

2000-04-25

Dawson, Robert

Stock material or miscellaneous articles

Composite

Of epoxy ether

428418, 523204, 523205, 523207, 523440, B32B 1710, B32B 2738

Patent

active

060542225

ABSTRACT:
An epoxy resin composition comprising (a) an epoxy resin, (b) a curing agent, (c) a cure accelerator and (d) silica powder. The silica powder (d) is composed of (d1) a first silica powder having a particle diameter ranging from 5 to 75 .mu.m, (d2) a second silica powder having a particle diameter ranging from 0.2 to 0.9 .mu.m, and (d3) a third silica powder having a particle diameter ranging from 0.01 to 0.08 .mu.m.

REFERENCES:
patent: 5116885 (1992-05-01), Hattori et al.

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