Epoxy resin composition for use in sealing semiconductors

Details Epoxy resin composition for use in sealing semiconductors Epoxy resin composition for use in sealing semiconductors

1990-10-29

1991-12-17

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523460, C08K 330, C08K 308

Patent

active

050735802

ABSTRACT:
An epoxy resin composition for use in sealing semiconductors, having enhanced moisture resistance reliability is disclosed, which comprises an epoxy resin and an oxyacid bismuth oxyhydroxide represented by the following formula (1):

REFERENCES:
patent: 4282136 (1981-08-01), Hunt et al.
patent: 4668719 (1987-05-01), Kato et al.
patent: 4716184 (1987-12-01), Kagawa et al.
Indian Journal of Technology, vol. 16, May 1978, pp. 211-212.

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