Epoxy resin composition for semiconductor sealing employing trip

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

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Details

523466, 525481, 525482, 525484, 525485, 525486, 525488, 525504, 525507, C08G 5932

Patent

active

050011740

ABSTRACT:
An epoxy resin composition for semiconductor sealing which comprises, as essential components,

REFERENCES:
patent: 4390664 (1983-01-01), Kanayama
patent: 4615741 (1986-10-01), Kobayashi et al.
patent: 4701479 (1987-10-01), Shiobara et al.
patent: 4720515 (1988-01-01), Iji et al.

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