Epoxy resin composition for semiconductor sealing

Details Epoxy resin composition for semiconductor sealing Epoxy resin composition for semiconductor sealing

1990-10-25

1992-09-01

Marquis, Melvyn I.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

525476, 528 33, 523466, 523457, C08F28310, C08F28312, C08G 7738, C08G 7704

Patent

active

051439514

ABSTRACT:
An epoxy resin composition for semiconductor sealing, comprising as essential components:

REFERENCES:
patent: 3635843 (1972-01-01), Parry et al.
patent: 4720515 (1988-01-01), Iji et al.
Patent Abstracts of Japan, vol. 10, No. 239 (C-367)(2295) Aug. 19, 1986 & JP-A-1 073 725 (Denki Kagaku KK) Apr. 15, 1986 *abstract*.
World Patents Index Latest Derwent Publications Ltd., London, GB; AN 89-280905 & JP-A-1 203 423 (Matsushita) Aug. 16, 1989 *abstract*.
Patent Abstracts of Japan vol. 13, No. 61 (C-567)(3409) Feb. 10, 1989 & JP-A-63 251 419 (Toray Ind Inc.) Oct. 18, 1988 *abstract*.

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