Epoxy resin composition for semiconductor encapsulation and...

Details Epoxy resin composition for semiconductor encapsulation and... Epoxy resin composition for semiconductor encapsulation and...

2005-04-12

2005-04-12

Tucker, Philip (Department: 1712)

Stock material or miscellaneous articles

Composite

Of epoxy ether

C438S127000, C523S400000, C523S457000, C528S087000, C528S088000, C528S219000

Reexamination Certificate

active

06878448

ABSTRACT:
The present invention provides a biphenyl based epoxy resin comprising a curing agent and an inorganic filler containing an alkali alkaline earth metal oxide wherein the epoxy resin has a variation rate of hardness at 25° C. and a relative humidity of 50% for 72 hours of less than 10% and a variation rate of flow at 25° C. and a relative humidity of 20% or below for 72 hours of less than 20%.

REFERENCES:
patent: 4042550 (1977-08-01), Tuller et al.
patent: 5453453 (1995-09-01), Lamon et al.
patent: 6248454 (2001-06-01), Ikemura
patent: 58-80340 (1983-05-01), None
patent: 58-174434 (1983-10-01), None

Affiliated with

Also associated with

Rating

Epoxy resin composition for semiconductor encapsulation and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Epoxy resin composition for semiconductor encapsulation and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epoxy resin composition for semiconductor encapsulation and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3437997