Epoxy resin composition for semiconductor encapsulation,...

Details Epoxy resin composition for semiconductor encapsulation,... Epoxy resin composition for semiconductor encapsulation,...

2005-11-08

2005-11-08

Sellers, Robert (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C257S791000, C257S793000, C525S065000

Reexamination Certificate

active

06962957

ABSTRACT:
An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 μm or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 μm or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 μm or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

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