Stock material or miscellaneous articles – Composite – Of epoxy ether
Reexamination Certificate
2004-11-30
2011-11-22
Feely, Michael J (Department: 1761)
Stock material or miscellaneous articles
Composite
Of epoxy ether
C523S435000, C525S525000
Reexamination Certificate
active
08062750
ABSTRACT:
An epoxy resin composition for a prepreg used in manufacturing a printed wiring board, particularly a multilayered printed wiring board, is provided. The composition features: (A) a multifunctional epoxy resin having on average 2.8 or more epoxy groups per molecule; (B) a reaction product of a phosphorous compound, a bifunctional epoxy resin, and an optional multifunctional epoxy resin, provided in an amount of 20% to 55% by mass, based on the total amount of epoxy resin, including (A) and (B); (C) a curing agent of dicyandiamide and/or a multifunctional phenolic compound; and (D) an inorganic filler blend containing an inorganic filler with a thermal decomposition temperature of 400° C. or above. The composition does not generate toxic substances when combusted and has excellent ignition resistance, solder heat resistance after moisture absorption, and high temperature rigidity.
REFERENCES:
patent: 6645630 (2003-11-01), Nakamura et al.
patent: 2003/0152776 (2003-08-01), Kiuchi et al.
patent: 11124489 (1999-05-01), None
patent: 2000256537 (2000-09-01), None
patent: 2001278957 (2001-10-01), None
patent: 2001348420 (2001-12-01), None
patent: 2003277487 (2003-10-01), None
Machine translation of JP 2001278957 A, provided by the JPO website (no date).
Koizumi Takeshi
Motobe Hidetsugu
Nakamura Yoshihiko
Takahashi Ryuji
Feely Michael J
Matsushita Electric & Works Ltd.
Meyertons Eric B.
Meyertons Hood Kivlin Kowert & Goetzel P.C.
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