Epoxy resin composition for encapsulation of semiconductors

Details Epoxy resin composition for encapsulation of semiconductors Epoxy resin composition for encapsulation of semiconductors

1997-02-25

1998-05-26

Marquis, Melvyn I.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C08K 336, C08L 6302

Patent

active

057565643

ABSTRACT:
To provide an epoxy resin composition for encapsulation of semiconductors, which is superior in curability and can yield a cured product having low moisture absorption. The epoxy resin composition comprises the following components (a), (b), (c), and (d):

REFERENCES:
patent: 4719502 (1988-01-01), Ikeya et al.
patent: 5162400 (1992-11-01), Shiobara et al.

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