Epoxy resin composition for encapsulation of semi-conductor devi

Details Epoxy resin composition for encapsulation of semi-conductor devi Epoxy resin composition for encapsulation of semi-conductor devi

1985-07-31

1988-01-12

Ivy, C. Warren

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523438, 523456, 525 58, C08L 6300

Patent

active

047192550

ABSTRACT:
An epoxy resin composition for encapsulation of semiconductor device comprises the components (a), (b), (c) and at least one of the components (d) and (e) as shown below:

REFERENCES:
patent: 3057614 (1962-10-01), Greenlee
patent: 3098054 (1963-07-01), Rosenberg
patent: 3838094 (1974-09-01), Sporck
patent: 3932689 (1976-01-01), Watanabe
patent: 4304880 (1981-12-01), Flowers
patent: 4379916 (1983-04-01), Flowers
"Epoxy Resins"--Henry Lee & Kris Neville, pp. 3-21.
"Tg and Modulus of Various Epoxy Resins" (Torsional Rectangular Analysis) Dainippon Ink and Chemicals, Inc.
Abstract of Japan No. 57184242.
Abstract of Japan No. 58087121.
Patent Abstracts of Japan (Jun. 22, 1983), vol. 7, No. 143 (C-172) (1288).
Patent Abstracts of Japan (Aug. 28, 1984), vol. 8, No. 187 (C-240) (1624).
European Search Report.

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