Epoxy resin composition for encapsulating semiconductor and...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

Reexamination Certificate

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Details

C524S500000, C257S793000, C257SE23119

Reexamination Certificate

active

08008410

ABSTRACT:
There is provided an epoxy resin composition for encapsulating a semiconductor comprising an epoxy resin (A), wherein the epoxy resin (A) including: a crystalline epoxy resin (a1) having a melting point of 50° C. to 150° C., an epoxy resin (a2) represented by formula (1), and at least one epoxy resin (a3) selected from an epoxy resin represented by formula (2) and an epoxy resin represented by a formula (3):in which R1's, which may be the same or different, represent a hydrocarbon group having 1 to 4 carbon atoms; R2's, which may be the same or different, represent a hydrogen atom or a hydrocarbon group having 1 to 4 carbon atoms; m is an integer of 0 to 5; and n is an integer of 0 to 6.

REFERENCES:
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English machine translation of JP Patent Pub No. 2005-015689 A, Ogura et al, Jan. 20, 2005.
English machine translation of JP 2005-015689 A, Ogura et al, Jan. 20, 2005.
Office Action received in CN 200780034308 mailed Dec. 31, 2010. English translation provided.

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