Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2011-03-15
2011-03-15
Gulakowski, Randy (Department: 1766)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C524S451000, C524S445000, C525S523000, C523S433000
Reexamination Certificate
active
07906378
ABSTRACT:
An epoxy resin composition for encapsulating a semiconductor element and a semiconductor device manufactured using the epoxy resin composition are provided. The epoxy resin composition includes epoxy resin, a curing agent, at least one kind of an inorganic filler selected from the group consisting of silicates such as talc and calcined clay, oxides such as silica and fused silica, and hydroxides such as aluminum hydroxide and magnesium hydroxide, and a pH buffer agent having a pH buffer area of pH 4 to 8. Further, the semiconductor device is manufactured by encapsulating at least one semiconductor element with a cured product of the above epoxy resin composition. Such a semiconductor device can have excellent moisture resistance.
REFERENCES:
patent: 4675356 (1987-06-01), Miyata
patent: 5610443 (1997-03-01), Inagaki et al.
patent: 5919844 (1999-07-01), Shimizu et al.
patent: 6287532 (2001-09-01), Okada et al.
patent: 2004/0232532 (2004-11-01), Kuroda
patent: 2420561 (2006-05-01), None
patent: 60-42418 (1985-03-01), None
patent: 7-48500 (1995-02-01), None
patent: 11-240937 (1999-09-01), None
patent: 2001-234034 (2001-08-01), None
patent: 2002-053735 (2002-02-01), None
patent: 2002-80566 (2002-03-01), None
patent: 2002-294032 (2002-10-01), None
patent: 2002-371194 (2002-12-01), None
patent: 2003-277579 (2003-10-01), None
patent: 2005/097892 (2005-10-01), None
Bejoy (Resonance, Feb. 2001).
International Search Report (PCT/ISA/210, PCT/ISA/237 and PCT/ISA/220 forms).
Fang Shane
Gulakowski Randy
Smith , Gambrell & Russell, LLP
Sumitomo Bakelite Company Ltd.
LandOfFree
Epoxy resin composition for encapsulating semiconductor... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Epoxy resin composition for encapsulating semiconductor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epoxy resin composition for encapsulating semiconductor... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2674697