Epoxy resin composition for encapsulating semiconductor

Details Epoxy resin composition for encapsulating semiconductor Epoxy resin composition for encapsulating semiconductor

1995-10-18

1998-06-09

Wilson, Donald R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

528 32, C08L 6300, C08L 8307, C08G 7720

Patent

active

057635404

ABSTRACT:
An epoxy resin composition for encapsulating semiconductors containing 5 to 50 parts by weight of a silicone-based flexibility imparting agent, 100 parts by weight of an epoxy resin containing at least two epoxy groups in one molecule thereof, 50 to 150 parts by weight of a curing resin including a phenolic resin, and 200 to 1,000 parts by weight of an inorganic filler.

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Babu et al., Macromolecules, vol. 24, 4503-4509 (1991).
Y. Lai, P.R. Dvornic & R.W. Lenz; Journal of Polymer Science, Polymer Chemistry Edition, vol. 20, 2277-2288 (1982).
Y. Nagase, K. Ikeda & Y. Sekine; Chem. Abs., 98 (16), 126994, Polymer, 23 (11), 1646-1652 (1982).
M. Livingston, P.R. Dvornic & R.W. Lenz; Journal of Appl. Poly. Sci., 27, 3238-3251 (1982).
Noii, Chemistry and Technology of Silicones, pp. 139-140.

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