Epoxy resin composition for encapsulating semiconductor

Details Epoxy resin composition for encapsulating semiconductor Epoxy resin composition for encapsulating semiconductor

1983-10-21

1985-07-16

Lilling, Herbert J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523212, 523467, 525 92, 174 52PF, C08K 334, C08K 906, C08K 300, H05K 500

Patent

active

045297550

ABSTRACT:
An epoxy resin composition for encapsulating semiconductors and semiconductor elements is disclosed. This epoxy resin composition mainly comprises (a) a polyfunctional epoxy compound, (b) a styrene type block copolymer or styrene type block copolymer and liquid rubber, (c) a hardener for the epoxy compound and (d) an inorganic filler.

REFERENCES:
patent: Re30843 (1982-01-01), Flint
patent: 3723223 (1973-03-01), Le Compte
patent: 3936575 (1976-02-01), Watanabe et al.
patent: 4113914 (1978-09-01), Doss
patent: 4120913 (1978-10-01), Petrie
patent: 4133796 (1979-01-01), Bullman
patent: 4294733 (1981-10-01), Marzouki et al.

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