Epoxy resin composition for encapsulating semiconductor

Details Epoxy resin composition for encapsulating semiconductor Epoxy resin composition for encapsulating semiconductor

1986-05-16

1988-01-19

Jacobs, Lewis T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523400, 525476, C08L 8300, C08L 6300

Patent

active

047205156

ABSTRACT:
An epoxy resin composition is provided for encapsulating a semiconductor. The resin composition contains an epoxy resin, a phenol resin, a phenol-modified silicon-containing compound and an inorganic filler. The phenol-modified silicon-containing compound is obtained by reacting a first and/or second organic silicone compound (formulae (1-a), (1-b) and (2)) with an organic silicon compound (formula (3)) and with a phenol resin: ##STR1## wherein X stands for an organic group containing an epoxy group, Y for a polyoxyalkylene group and Z for a mercapto group, an amino group or a ureido group.

REFERENCES:
patent: 4291144 (1981-09-01), Takago

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