Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate
1999-04-21
2001-04-24
Dawson, Robert (Department: 1712)
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
C523S456000
Reexamination Certificate
active
06221510
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to an epoxy resin composition for encapsulating a photosemiconductor element (hereinafter briefly referred to as an “epoxy resin composition”) and a photosemiconductor device using the same.
BACKGROUND OF THE INVENTION
Previously, epoxy resin compositions have been used as encapsulating materials for photosemiconductors such as light receiving elements and light emitting elements from the view point that the encapsulating materials should be excellent in transparency, moisture resistance and heat resistance.
However, conventional epoxy resin compositions are excellent in transparency, but have the problem that when the epoxy resin compositions are formed, for example, transfer molded, in forming molds in which photosemiconductor elements are arranged to encapsulate the photosemiconductor elements with the resins, thereby producing photosemiconductor devices, the mold releasing property is extremely deteriorated in taking the photosemiconductor devices out of the forming molds. Accordingly, various problems arise such as deformation of the photosemiconductor devices due to stress on mold releasing, generation of cracks in packages, separation of the photosemiconductor elements from the encapsulating resins, and separation of gold wires.
In general, when epoxy resin compositions are transfer molded, releasing agents are added to the epoxy resin compositions for improving the mold releasing property of moldings. When the photosemiconductor elements are encapsulated with the epoxy resin compositions by transfer molding as described above, addition of releasing agents for improving the mold releasing property without deteriorating the transparency of the epoxy resin compositions has been proposed (JP-A-6-157817 (the term “JP-A” as used herein means an “unexamined published Japanese patent application”), WO096/15191).
It is considered that the mold releasing property appears due to the presence of the releasing agent on the interface between the epoxy resin composition and mold in forming. When the photosemiconductor element is encapsulated with the epoxy resin composition by forming, for example, transfer molding, it is considered that the releasing agent is also present on the interface between the epoxy resin composition and photosemiconductor element. In that case, the releasing agent may cause separation of the photosemiconductor element from the epoxy resin composition at the interface between them in a formed photosemiconductor device, sometimes resulting in impairment of the function of the photosemiconductor device.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide an epoxy resin composition excellent in releasing property from a mold in forming, for example, in transfer molding, excellent in adhesion to a photosemiconductor element, and good in transparency.
For attaining the above-mentioned object, the present invention provides an epoxy resin composition comprising the following components (A) to (D):
(A) an epoxy resin;
(B) a hardener;
(C) a silane coupling agent having an epoxy group, a mercapto group or an amino group; and
(D) a releasing agent in which a molecule thereof has structure moieties represented by the following general formulas (1) and (2), and in which the weight ratio of the structure moiety represented by general formula (2) is 25% to 95% by weight based on the whole molecule.
&Parenopenst;CH
2
CH
2
&Parenclosest;
m
(1)
wherein m is a positive integer of 8 to 100.
&Parenopenst;CH
2
CH
2
O&Parenclosest;
n
(2)
wherein n is a positive integer.
The above-mentioned silane coupling agent having an epoxy group, a mercapto group or an amino group, component (C), is preferably a compound represented by the following general formula (3):
wherein Y is a monofunctional organic group having an epoxy group, a mercapto group or an amino group; R
1
to R
3
each independently represents a methoxy group, an ethoxy group, a methyl group or an ethyl group, with the proviso that at least one of R
1
to R
3
is a methoxy group or an ethoxy group; and R
4
is an alkylene group having 2 to 5 carbon atoms.
The above-mentioned epoxy resin, component (A), preferably include a resin represented by the following general formula (4):
wherein R
6
is an organic compound residue having y active hydrogen atoms; n
1
, n
2
. . . n
y
each represents an integer of 0 or 1 to 100, and the sum thereof is 1 to 100; y is an integer of 1 to 100; and A is the following cyclohexane skeleton having a substituent group Z:
wherein Z is
—CH═CH
2
or —CH(OH)—CH
2
—OR
7
, wherein R
7
is a hydrogen atom, an alkyl group, a carboalkyl group or a carboaryl group, with the proviso that at least one of Z is
Further, the photosemiconductor device of the present invention is characterized in that a photosemiconductor element is encapsulated with the above-mentioned epoxy resin composition.
REFERENCES:
patent: 6001483 (1999-12-01), Harada et al.
patent: 02253645 (1990-10-01), None
patent: 03094454 (1991-04-01), None
patent: 03201470 (1991-09-01), None
Hattori Kuniharu
Komada Nariya
Noro Masato
Okuda Satoshi
Shimada Katsumi
Aylward D.
Dawson Robert
Nitto Denko Corporation
Sughrue Mion Zinn Macpeak & Seas, PLLC
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