Epoxy resin composition for encapsulating electric circuit compo

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

523219, 523443, 523444, C08K 906

Patent

active

051890801

ABSTRACT:
An encapsulating resin composition for electrical and electronic components consists of cycloaliphatic epoxy resin, a hardener, an accelerator, a filler and, sometimes, a pigment. As a result of the combination of the cycloaliphatic epoxy resin with the provision of methylnadic anhydride as hardener and amporhous SiO.sub.2 as a filler, the material is capable of flowing at room temperature, is physiologically harmless and also otherwise well suited for mass production of a wide variety of electrical and electronic components, for example diodes and other semi-conductors for the motor vehicle industry. A small addition of hollow glass spherical particles counteracts sedimentation of amorphous SiO.sub.2 in pre-hardening storage of the resin.

REFERENCES:
patent: 3849187 (1974-11-01), Fetscher et al.
patent: 4552907 (1985-11-01), Sato et al.
patent: 4665111 (1987-05-01), Hussain et al.
patent: 4772644 (1988-09-01), Itoh et al.
Katz et al; Handbook of Fillers and Reinforcement for Plastics; van Nostrand Reinhold Co.; 1978; pp. 326-327.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Epoxy resin composition for encapsulating electric circuit compo does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Epoxy resin composition for encapsulating electric circuit compo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epoxy resin composition for encapsulating electric circuit compo will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2205419

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.