Epoxy resin composition for a copper-clad laminate

Details Epoxy resin composition for a copper-clad laminate Epoxy resin composition for a copper-clad laminate

1988-09-06

1989-05-23

Ivy, C. Warren

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525481, 525486, 525487, 528 94, C08L 6300, C08L 6110, C08L 2902

Patent

active

048332046

ABSTRACT:
An epoxy resin composition for a copper-clad laminate comprising an epoxy resin having at least two epoxy groups in one molecule, a phenolic compound having at least two functional groups in one molecule as a hardener, an imidazole compound having a masked imino group as a hardening accelerator, and one or more of nitrogen compounds selected from the group consisting of urea derivatives represented by the formula R.sup.1 --NH--CO--NH.sub.2, wherein R.sup.1 is hydrogen or an organic group; acid amide compounds; and guanidine derivatives, which is advantageously used for the material of a copper-clad laminate. Accordingly, the copper-clad laminate is especially used for the production of printed circuit boards, and its drilling property, peeling resistance of the copper foil, adhesive property, and heat resistance are improved remarkably. In addition, this epoxy resin composition has an excellent storing stability.

REFERENCES:
patent: 3493630 (1970-02-01), Salensky
patent: 3756984 (1973-09-01), Klaren
patent: 4026872 (1977-05-01), Saida
patent: 4066625 (1978-01-01), Bolger
patent: 4240605 (1983-12-01), Kaufman
patent: 4246394 (1981-01-01), Schulde
patent: 4335228 (1982-06-01), Beitchman
patent: 4358571 (1982-11-01), Kaufman
patent: 4436892 (1984-03-01), Zondler
patent: 4514556 (1985-04-01), Sawa
patent: 4533715 (1985-08-01), Lee
patent: 4552814 (1985-11-01), Cavitt
patent: 4559398 (1985-12-01), Tesch
Abandoned U.S. Ser. No. 06/065,664 cited in U.S. Pat. No. 4,240,605.

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