Epoxy resin composition,cured article thereof, semiconductor...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From phenol – phenol ether – or inorganic phenolate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C528S096000, C528S097000

Reexamination Certificate

active

07985822

ABSTRACT:
An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).

REFERENCES:
patent: 3787451 (1974-01-01), Mah
patent: 4464521 (1984-08-01), Gruber
patent: 5597876 (1997-01-01), Murata et al.
patent: 5677397 (1997-10-01), Nakamura et al.
patent: 6784228 (2004-08-01), Ogura et al.
patent: 2002/0156189 (2002-10-01), Ogura et al.
patent: 2004/0265596 (2004-12-01), Maeda
patent: 4-277518 (1992-10-01), None
patent: 8-301980 (1996-11-01), None
patent: 11-140167 (1999-05-01), None
patent: 2000-212238 (2000-08-01), None
patent: 2001-64340 (2001-03-01), None
patent: 2003-201333 (2003-07-01), None
patent: 2004-10700 (2004-01-01), None
patent: 2004010700 (2004-01-01), None
English machine translation of JP Patent Pub No. 2004-010700 A, Taihichi et al, Jun. 5, 2002.
International Search Report of PCT/JP2005/015867, date of mailing Nov. 8, 2005.
European Search Report dated Apr. 6, 2009, issued in corresponding European Patent Application No. 05776808.7.
Non-Final Office Action dated Mar. 8, 2010 issued in related U.S. Appl. No. 11/817,535.
Supplementary European Search Report dated Apr. 6, 2009, issued in European Patent Application No. 05776808.7.
International Search Report of PCT/JP2006/303902, date of mailing Apr. 18, 2006.
Supplementary European Search Report dated Apr. 6, 2009, issued in European Patent Application No. 06715019.3.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Epoxy resin composition,cured article thereof, semiconductor... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Epoxy resin composition,cured article thereof, semiconductor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epoxy resin composition,cured article thereof, semiconductor... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2657038

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.