Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Patent
1994-04-06
1996-02-27
Krass, Frederick
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
523428, 523443, 523466, 525481, 525482, 525484, 528102, 528103, 549560, C08L 6300
Patent
active
054949505
ABSTRACT:
An epoxy resin composition comprising an epoxy resin component containing at least 5% by weight of an epoxy resin of Formula [I], an epoxy hardener, and an inorganic filler as essential constituents: ##STR1## [wherein R and R.sup.1 denote alkyl of C.sub.2 to C.sub.6, and n is an integer repetition unit from 0 to 10] The epoxy resin composition, when used as a molding material, is low in water absorption rate and flexural modulus (low stress).
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patent: 4876324 (1989-10-01), Nakano et al.
patent: 4900801 (1990-02-01), Takata et al.
patent: 5360837 (1994-11-01), Honda et al.
Chemical Abstracts 114:34416, "Printed Circuit Boards Containing Epoxy Resin Compositions", Tominaga et al.
Chemical Abstracts 113:98814, "Low Dielectric Epoxy Resin Compositions Containing Polystyrene", Tominaga et al.
Chemical Abstracts: 71(13) 60943k.
Chemical Abstracts: 67(3) 11288j.
Chemical Abstracts: 117(22) 213828x.
Chemical Abstracts: 113(20) 173472k.
Chemical Abstracts: 104(26) 234346k.
Chemical Abstracts: 83(22) 180167e.
Chemical Abstracts: 80(22) 122584r.
Chemical Abstracts: 70(16) 69336b.
Chemical Abstracts: 74(14) 64985k.
Chemical Abstracts: 75(3) 19950e.
Chemical Abstracts: 70(10) 38401g.
Chemical Abstracts: 67(17) 82131p.
Chemical Abstracts: 71(14) 62170e.
Aritomi Michio
Asakage Hideyasu
Wu Xiao Li
Krass Frederick
Totokasei Co., Ltd.
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