Epoxy resin composition containing a polyaminoamide and a latent

Details Epoxy resin composition containing a polyaminoamide and a latent Epoxy resin composition containing a polyaminoamide and a latent

1992-11-27

1994-09-27

Marquis, Melvyn I.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From phenol, phenol ether, or inorganic phenolate

528 99, 528103, 528113, 525423, 525510, 525935, C08G 6510

Patent

active

053508262

ABSTRACT:
An epoxy resin composition for forming prepregs is disclosed which includes an epoxy resin having at least two epoxy groups, a latent curing agent for the epoxy resin in an amount of 0.5-3.0 equivalents per equivalent of the epoxy groups of the epoxy resin, and a reactive, viscosity-increasing agent in an amount of 0.2-3.0 parts by weight per 100 parts by weight of the epoxy resin. The epoxy resin composition has an initial viscosity n.sub.I(50) at 50.degree. C. of 1,000-200,000 cP and an initial viscosity n.sub.I(23) at 23.degree. C. of at least 10,000 cP.

REFERENCES:
patent: 4129670 (1978-12-01), Riew
patent: 4214067 (1980-07-01), Packer
patent: 4298656 (1981-11-01), Mendelsohn
patent: 4525571 (1985-06-01), Burba et al.
patent: 4657986 (1987-04-01), Isayama et al.
patent: 4874833 (1989-10-01), Kershaw
patent: 4981728 (1991-01-01), Homma et al.
patent: 5011721 (1991-04-01), Decker et al.

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