Epoxy resin composition comprising red phosphorus

Details Epoxy resin composition comprising red phosphorus Epoxy resin composition comprising red phosphorus

1996-12-10

1999-02-09

Krass, Frederick

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523208, C08L 6300, C08K 302, C08K 328, H01B 340

Patent

active

058695532

ABSTRACT:
An epoxy resin composition for encapsulating a semiconductor, which is free from halogen and antimony and has excellent soldering crack resistance and high-temperature storage life without lowering the flame-retardancy, and which comprises as essential components (A) an epoxy resin, (B) a phenol resin curing agent, (C) a curing accelerator, (D) an inorganic filler and (E) a red phosphorus-based flame-retardant, wherein the ratio of (a) the number of epoxy groups of the epoxy resin to (b) the number of phenolic the amount of the inorganic filler (D) contained in the epoxy resin composition is 70 to 90% by weight based on the total weight of the epoxy resin composition and the cured product of the epoxy resin composition has a glass transition temperature of 100.degree. to 160.degree. C. and a linear expansion coefficient at 25.degree. C. of 0.8 to 1.8.times.10.sup.-5 /.degree.C.

REFERENCES:
patent: 4668719 (1987-05-01), Kato et al.
patent: 4879067 (1989-11-01), Sakon et al.
patent: 5360837 (1994-11-01), Honda et al.

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