Epoxy resin composition and semiconductor sealing material compr

Details Epoxy resin composition and semiconductor sealing material compr Epoxy resin composition and semiconductor sealing material compr

1990-01-16

1991-11-12

Kight, III, John

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

525481, 525482, 525486, C08G 5962, C08G 5968

Patent

active

050648810

ABSTRACT:
Disclosed is an epoxy resin composition comprising, as basic components, (A) an epoxy resin, (B) a phenol-novolak resin, (C) a curing promotor and (D) a filler. Pulverized or spherical silica having specific particle size characteristics is used as the filler (D). Preferably, a halogenated epoxy resin and antimony oxide are further incorporated in this epoxy resin. This epoxy resin composition shows a very small molding shrinkage. If a dialkylurea derivative is used as the curing promotor (C), the stability of the composition at about 100.degree. C. is drastically improved and the flowability of the composition is improved. Accordingly, precision injection molding becomes possible, and the effect of sealing a semiconductor is enhanced.

REFERENCES:
patent: 4615741 (1986-10-01), Kobayashi et al.
patent: 4701479 (1987-10-01), Shiobara et al.
patent: 4720515 (1988-01-01), Iji et al.
patent: 4876324 (1989-10-01), Nakano et al.

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