Epoxy resin composition and semiconductor device encapsulated th

Details Epoxy resin composition and semiconductor device encapsulated th Epoxy resin composition and semiconductor device encapsulated th

1989-06-29

1991-04-09

Nielsen, Earl

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525487, 523443, 523445, 523466, 523457, C08L 6302, C08L 6304

Patent

active

050066145

ABSTRACT:
A curable epoxy resin is blended with (a) an alkenyl group-containing epoxidized novolak resin/organopolysiloxane copolymer and (b) a polyimide resin in addition to a curing agent and an inorganic filler. The resulting epoxy resin composition can be cured both under moisture-free conditions and even under moist conditions without inducing a crack. It is suitable for the encapsulation of semiconductor devices as well as for molding and powder coating.

REFERENCES:
patent: 2819245 (1958-07-01), Shorr
patent: 4376174 (1983-03-01), Itoh et al.
patent: 4657986 (1987-04-01), Isayama et al.
patent: 4877822 (1989-10-01), Itoh et al.

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