Epoxy resin composition and semiconductor device

Details Epoxy resin composition and semiconductor device Epoxy resin composition and semiconductor device

2011-07-12

2011-07-12

Sellers, Robert (Department: 1796)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C257S791000, C523S453000, C523S467000, C523S468000, C525S109000

Reexamination Certificate

active

07977412

ABSTRACT:
An epoxy resin composition for encapsulating semiconductors which comprises as essential components (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) a component comprising (e1) a butadiene-acrylonitrile copolymer having carboxyl group and/or (e2) a reaction product of (e1) a butadiene-acrylonitrile copolymer having carboxyl group with an epoxy resin, wherein the content of component (e1) in the entire epoxy resin composition is 0.01 to 1% by weight. The composition exhibits excellent releasing property in molding, continuous molding property and resistance to solder reflow.

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