Epoxy resin composition, and resin-sealed semiconductor device i

Details Epoxy resin composition, and resin-sealed semiconductor device i Epoxy resin composition, and resin-sealed semiconductor device i

1986-08-04

1988-01-12

Thomas, Alexander S.

Stock material or miscellaneous articles

Composite

Of bituminous or tarry residue

428 76, 525485, H01L 2330

Patent

active

047195029

ABSTRACT:
An epoxy resin composition for sealing, and a resin-sealed type semiconductor device in which this composition is used, of outstanding heat cycle resistance, humidity resistance and laser marking characteristics, can be obtained by using a combination of an organic phosphine compound and a metal complex dye. The epoxy resin composition, characterized in that it consists of epoxy resin, a curing agent having at least 2 phenolic hydroxyl groups per molecule, an organic phosphine compound and a metal complex dye; and to a resin-sealed type semiconductor device characterized in that it is sealed with this composition.

REFERENCES:
patent: 4572853 (1986-02-01), Ikeya et al.

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