Epoxy resin composition and resin-encapsulated semiconductor dev

Details Epoxy resin composition and resin-encapsulated semiconductor dev Epoxy resin composition and resin-encapsulated semiconductor dev

1995-09-08

1997-07-08

Krass, Frederick

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523466, 523457, 523458, 549556, 257786, 257793, 525481, 525484, 528101, C08G 5924, C08G 5962, H01L 2329

Patent

active

056462042

ABSTRACT:
An epoxy resin composition comprising (A) an epoxy resin represented by the general formula (1) ##STR1## wherein each R.sub.1, independent of the other, represents hydrogen, a hologen atom, an alkyl group having 1 to 6 carbon atoms, substituted- or nonsubstituted-phenyl groups, and X represents ##STR2## and n represents an integer of 0 to 4, and (B) a curing agent, which composition provides a cured product exhibiting low hygroscopicity and high adhesiveness.

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