Epoxy resin composition and prepreg made with the epoxy...

Stock material or miscellaneous articles – Composite – Of epoxy ether

Reexamination Certificate

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C428S297400, C428S375000, C428S396000, C523S400000, C528S087000, C528S088000, C528S119000, C528S120000, C528S121000, C528S122000

Reexamination Certificate

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06838176

ABSTRACT:
Epoxy resin compositions comprising (a) an epoxy resin, (b) a latent curing agent with curing power at 100° C. or below and (c) an aromatic amine-based curing agent and/or an alicyclic amine-based curing agent, which are curable in two stages, or epoxy resin compositions further comprising (d) a curing accelerator, as well as a prepregs comprising reinforcing fiber materials impregnated with the epoxy resin compositions. The compositions give die-releasable cured products by primary curing at low temperature, give highly heat-resistant cured products by secondary curing, and exhibit satisfactory stability at room temperature.

REFERENCES:
patent: 5179139 (1993-01-01), Sugimori et al.
patent: 5350826 (1994-09-01), Watanabe et al.
patent: 5357008 (1994-10-01), Tsai et al.
patent: 590975 (1994-04-01), None
patent: 6-16838 (1994-01-01), None
patent: 7-2975 (1995-01-01), None
patent: 7-70406 (1995-03-01), None
patent: 7-70410 (1995-03-01), None
patent: 8-208812 (1996-08-01), None
patent: 8-225667 (1996-09-01), None
patent: 10-36532 (1998-02-01), None
patent: 10-45925 (1998-02-01), None
patent: 10-292031 (1998-11-01), None
patent: 11-246741 (1999-09-01), None
patent: 11-279261 (1999-10-01), None
Machine Translation of JP 10-045925, provided by the JPO website.*
Patent Abstracts of Japan, JP 58-168620, Oct. 5, 1983.
Derwent Abstract, XP-002243407, JP 06-157876, Jun. 7, 1994.

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