Epoxy resin composition and multilayer printed wiring board havi

Details Epoxy resin composition and multilayer printed wiring board havi Epoxy resin composition and multilayer printed wiring board havi

1990-04-02

1992-03-10

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523440, 523443, 523446, C08K 700

Patent

active

050950479

ABSTRACT:
A thermosetting resin composition suitable for forming an insulating layer to be interposed between two adjacent wiring patterns of a multilayer printed wiring board is disclosed which includes a bisphenol AD epoxy resin, an aromatic polyamine, mica having an average particle size of 50 .mu.m or less, and silica having an average particle size of 20 .mu.m or less, the average particle size of the silica being smaller than that of the mica, and the amount of the silica being 20-80% based on the total weight of the silica and the mica.

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