Epoxy resin composition and electronic part

Details Epoxy resin composition and electronic part Epoxy resin composition and electronic part

2005-06-14

2005-06-14

Feely, Michael J. (Department: 1712)

Stock material or miscellaneous articles

Composite

Of epoxy ether

C438S127000, C523S452000

Reexamination Certificate

active

06905768

ABSTRACT:
The epoxy resin of the invention comprises (A) an epoxy resin, (B) at least one member selected from the group consisting of a phenolic hydroxyl group-containing compound, a urea resin and a melamine resin, (C) a crosslinked phenoxyphosphazene compound, and (D) an inorganic filler powder, the amount of component (C) being in the range of 0.01 to 30 wt. % based on the total amount of components (A), (B) and (C), and the amount of component (D) being in the range of 60 to 98 wt. % based on the total amount of components (A), (B), (C) and (D). The epoxy resin composition of the invention and a molded product are halogen-free and antimony-free and are excellent in flame retardancy. When an element for an electronic part such as LSI and VLSI is encapsulated by the epoxy resin composition of the invention, the obtained electronic part is outstanding in heat resistance, moisture resistance, thermal impact resistance and like properties.

REFERENCES:
patent: 6399677 (2002-06-01), Tomiyoshi et al.
patent: 6528559 (2003-03-01), Nakacho et al.
patent: 6596893 (2003-07-01), Nakacho et al.
patent: 0 945 478 (1999-09-01), None
patent: 10-259292 (1998-09-01), None
patent: WO 00/09518 (2000-02-01), None

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